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Heat dissipation sheet×日本旭立科技 - List of Manufacturers, Suppliers, Companies and Products

Heat dissipation sheet Product List

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Incredible heat dissipation! Ultra-soft ultra-high thermal conductivity value 15W/mK heat dissipation sheet.

This is a heat dissipation material that achieves both ultra-softness (Shore000) and ultra-high thermal conductivity (15.0W/m*K). [Catalog available]

◆ It has an ultra-high thermal conductivity of 15.0 W/mK. ◆ With ultra-high compressibility, a compression force of 50 psi achieves a volume compression rate of 79%, resulting in low thermal resistance (1.0 mm thickness). ◆ This is a thermal conductive material that combines ultra-softness (Shore 000) with ultra-high thermal conductivity (15.0 W/m*K). ◆ Due to its ultra-high compressibility, it can easily fill tiny gaps and conduct heat at an extremely fast rate between the heating element and the heat sink or housing. Since mold forming is done in-house, we can accommodate detailed requests regarding sheet shape, mold forming, cutting specifications, etc. ◆ UL flame retardant and RoHS compliant. *For more details, please download the catalog or feel free to contact us.

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Heat dissipation sheet "PK Series"

We can also accommodate forming through customization.

The "PK Series" is a gap-filling thermal interface material with a thermal conductivity of 2.0-7.0 W/m*K. It has a hardness of Shore OO/30-50, and possesses flexibility, compressibility, insulation properties, and self-adhesiveness, effectively filling design tolerances in mechanisms and demonstrating high stability. Additionally, our sheets can be customized for forming. Please feel free to consult us if you have any requests. 【Product Lineup】 ■PK223 ■PK404 ■PK504 ■PK605 ■PK700 *For more details, please download the PDF (English version) or feel free to contact us.

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Heat dissipation sheet "BS Series"

We can provide customers with special needs for cutting-edge products.

The "BS Series" is a thermal conductive sheet that is very soft and elastic, with excellent resistance to deformation. It can prevent deformation of components such as PCBs due to assembly stress. With a thermal conductivity of 3.0-5.0 W/m*K, this gap-filling thermal material has a hardness of Shore OO/10-25, and features flexibility, compressibility, insulation, and self-adhesiveness, effectively filling design tolerances in mechanisms and demonstrating high stability. 【Series Lineup】 ■BS75K ■BS87-S ■BS89 ■S282-s *For more details, please download the PDF (English version) or feel free to contact us.

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